标准号T/CMIF 137—2021状态
发布时间：2021年01月19日
实施时间：2021年03月01日
半导体封装键合用银金合金丝基本信息
标准号：T/CMIF 137—2021
团体名称：中国标准化协会
主要技术内容：前言····························································································································III1范围··························································································································12规范性引用文件··········································································································13术语和定义·················································································································14产品分类····················································································································14.1产品代号···············································································································14.2产品分类···············································································································15技术要求····················································································································25.1化学成分················································································································25.2电阻率··················································································································25.3直径及极限偏差······································································································25.4力学性能···············································································································35.5表面质量···············································································································55.6卷曲和扭曲············································································································65.7绕丝·····················································································································65.8放丝·····················································································································66试验方法····················································································································67检验规则····················································································································67.1检验分类···············································································································67.2检验项目···············································································································67.3组批规则和抽样方案································································································77.4判定规则···············································································································78标志、包装、运输和储存······························································································88.1标志·····················································································································88.2包装·····················································································································88.3运输·····················································································································88.4储存·····················································································································89质量证明文件··············································································································8
中国标准分类号：C4090 其他仪器仪表制造业
国际标准分类号：31.190
发证机关：中华人民共和国民政部
行业分类：
标准名称：半导体封装键合用银金合金丝
本文件规定了半导体封装键合用银金合金丝的产品分类、技术要求、试验方法、检验规则、标志、包装、运输和贮存。 本文件适用于半导体封装键合用银金合金丝。